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Layer under 38249999 global Supplier Data

Layer product global trade data has found a total of 8 unique records from the application, which has unique exporters in countries and unique buyers in 1 countries. Latest record found from the month of May 2022 and oldest record was from Jan 2017.

3 exporter and 1 Importer shipments are available in the application of Layer product.

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HSN Code Product Description Imports Exporter Origin Destination Qty. More Columns
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38249999 OCH.W00003#&CHEMICAL FOR REMOVING TI LAYER ON WAFER (WTE-100A), HYDROGEN PEROXIDE CONTENT 30%; WATER 68% FOR STRIPPING (CLEANING) PART BEFORE WLP (UN2014 / CLASS 5.1 / PG II), NEW 100% lock lock KOREA, REPUBLIC OF Vietnam 200 60 More Columns Available
38249999 OCH.W00004#&CHEMICAL FOR REMOVING TI LAYER ON WAFER (WTE-100B), POTASSIUM HYDROXIDE CONTENT 17%; WATER 73% FOR STRIPPING (CLEANING) PART BEFORE WLP (UN1814/CLASS 8/PG II), 100% NEW lock lock KOREA, REPUBLIC OF Vietnam 84
38249999 OCH.W00002#&CHEMICAL FOR REMOVING CU LAYER ON WAFER( MKS-4000N PHS )DI WATER 88.8%;HYDROGEN PEROXIDE 1.2% FOR STRIPPING (CLEANING) PARTS BEFORE WLP(NON-DG ), 100% NEW lock lock KOREA, REPUBLIC OF Vietnam 500
38249999 OCH.W00012#&BMS-903A SOLUTION USED TO REMOVE COPPER LAYER ON WAFER SURFACE AFTER UV IRRADIATION.TP:SULFINYLBISMETHANE 85~90%,1,2-ETHANEDIOL 5~10%,WATER 1~5%,TETRAMETHYLAMMONIUM HYDROXIDE 0.6 ~1%, 100% NEW lock lock KOREA, REPUBLIC OF Vietnam 440

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