LLC INTERRESURS TRADE DATA ANALYSIS
Access comprehensive trade data for Llc Interresurs with ease. Explore trade shipments, top suppliers & buyers, and values without the hassle.
Llc Interresurs – Overview
Eximpedia analyzes Llc Interresurs export and import records, including data from 0 buyers and 6 suppliers. We provide an intelligence report of Llc Interresurs that covers trade statistics, shipment values, quantities, exporters & importers and trade destinations
Llc Interresurs Buyers, Suppliers & Shipments
Llc Interresurs import markets
Explore the Llc Interresurs import market with monthly import values, major importers, HS Codes, key ports, top suppliers, and competitors
TOP IMPORT HS CODE
| HS CODE | USD VALUE | SHIPMENTS | % |
|---|---|---|---|
| 8486209009 | 2.38 | 22 | 5.57 |
| 8414805100 | 0.29 | 4 | 1.01 |
| 8486209003 | 0.26 | 5 | 1.27 |
| 8421210009 | 0.21 | 8 | 2.03 |
| 8486209001 | 0.14 | 9 | 2.28 |
TOP IMPORT COUNTRY
| COUNTRY | USD VALUE | SHIPMENTS | % |
|---|---|---|---|
| ISRAEL | 3.10 | 320 | 81.01 |
| TURKEY | 0.34 | 25 | 6.33 |
| CHINA | 0.18 | 25 | 6.33 |
| SLOVENIA | 0.04 | 1 | 0.25 |
| ITALY | 0.03 | 5 | 1.27 |
TOP IMPORT PORTS
| PORT NAME | USD VALUE | SHIPMENTS | % |
|---|---|---|---|
| NOVOROSSIYSK | 3.17 | 343 | 86.84 |
| SAINT PETERSBURG | 0.38 | 27 | 6.84 |
| MOSCOW | 0.12 | 19 | 4.81 |
| BEIJING | 0.03 | 4 | 1.01 |
| NANSHA | 0.03 | 2 | 0.51 |
TOP IMPORT COMPETITORS
| COMPANY | USD VALUE | SHIPMENTS |
|---|---|---|
| LLC INTERRESURS | 4.77 | 395 |
| LLC FABTSENTR | 10.35 | 512 |
| SP LLC NUKUSELESTROAPPARAT | 10.63 | 91 |
| JOINT STOCK COMPANY DIPOLE TECHNOLOGIES | 11.30 | 109 |
| ENKOR GROUP LLC | 36.20 | 470 |
TOP IMPORT SUPPLIERS
| COMPANY | USD VALUE | SHIPMENTS |
|---|---|---|
| BOSPHORUS GATE DIS TICARET LIMITED SIRKETI | 4.77 | 1030 |
| ALPTECH MACHINERY AND INDUSTRY LIMITED CO | 8.24 | 305 |
| ZHEJIANG CHINT INSTRUMENT AND METER CO LIMITED | 10.63 | 641 |
| ON TIME EXPRESS LIMITED | 10.73 | 254 |
| SHENZHEN S C NEW ENERGY TECHNOLOGY CORPORATION | 25.47 | 2311 |
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Llc Interresurs Import Shipments
Discover the Llc Interresurs with product description, import values, quantities, exporter name, country of origin and key destinations.
| HSN Code | Product Description | Imports | Exporter | Origin | Destination | Qty. |
|---|---|---|---|---|---|---|
| 8414807500 | POSITION ROTARY COMPRESSORS: ROTORY SCREW TWIN-SHAVE COMPRESSOR UNIT, POWER 15KW, WITH MAXIMUM OPERATING PRESSURE 16 BAR, CAPACITY 1280 L/MIN, VOLTAGE 380 V, FREQUENCY 50 HZ: LOCATED ON RECEIVER WITH CAPACITY 500 L:P |  |
|
CHINA | RUSSIA | 1 |
| 8462230009 | CNC PRESS BRAKES: A PRESS BRAKE WITH A BENDING FORCE OF 1600 KN, A POWER OF 15 KW, PROVIDES HIGH PRECISION AND SPEED BENDING OF SHEET METAL. SYNCHRONIZATION OF THE OPERATION OF HYDRAULIC CYLINDERS IS PROVIDED BY CONTROLLED SOLENOID VALVES | |
|
CHINA | RUSSIA | 1 |
| 8544429007 | ELECTRICAL CABLES, EQUIPPED WITH CONNECTING DEVICES FOR 24 V VOLTAGE, WITH COPPER CONDUCTORS. NON-FIRE RESISTANT: SPARE PARTS FOR SEMI-AUTOMATIC DISC CUTTING INSTALLATION MODEL ADT 7122, FOR THE PRODUCTION OF ELECTRONIC COMPONENTS AND CERAMICS | |
|
ISRAEL | RUSSIA | 0 |
| 8302490009 | FASTENING ACCESSORIES, SPARE PARTS FOR SEMI-AUTOMATIC DISC CUTTING INSTALLATION MODEL ADT 7122, FOR THE PRODUCTION OF ELECTRONIC COMPONENTS AND CORE | |
|
ISRAEL | RUSSIA | 0 |
| 8486901000 | DEVICES FOR FASTENING TOOLS FOR USE ON EQUIPMENT DESIGNED FOR PRECISION DISC CUTTING OF SEMICONDUCTOR WAFERS AND SUBTRACTS. FOR THE PRODUCTION OF ELECTRONIC COMPONENTS, CIVIL PURPOSE: 2 FLANGES, OVERALL DIMENSIONS: 1.9 | |
|
ISRAEL | RUSSIA | 0 |
| 6804223000 | GRINDING STONES FROM AGGLOMERATED ARTIFICIAL ABRASIVES WITH A BINDING SUBSTANCE FROM CERAMIC OR SILICATE MATERIALS. FOR EQUIPMENT DESIGNED FOR PRECISION DISC CUTTING OF ELECTRONIC COMPONENTS, CIVIL PURPOSE: CORRECT CAME | |
|
ISRAEL | RUSSIA | 0 |
| 9026102900 | ELECTRONIC LIQUID LEVEL METERS DO NOT CONTAIN A SOURCE OF IONIZING RADIATION, DO NOT EMERGENCY CONDITION SENSORS, DO NOT CONTAIN RES AND RF. CIVIL PURPOSE, PARTS FOR SEMI-AV | |
|
ISRAEL | RUSSIA | 1 |
| 8486209009 | MACHINES AND EQUIPMENT FOR THE PRODUCTION OF SEMICONDUCTOR DEVICES OR ELECTRONIC INTEGRATED CIRCUITS. CIVIL APPLICATION: ADT 966 SERIES INSTALLATION FOR INSTALLATION OF SEMICONDUCTOR WAVES AND SUBTRACTS ON A FILM CARRIER, THE INSTALLATION IS DESIGNED FOR INSTALLATION OF SEMICONDUCTOR WARES ON A FILM CARRIER UP TO 8 PER CARRIER FRAME, POWER SUPPLY 220 V, 50 G C, 0.75 KW DELIVERY SET IS PARTLY SUPPLIED FOR EASY TRANSPORTATION DISASSEMBLED | |
|
ISRAEL | RUSSIA | 1 |
| 9026202000 | ELECTRONIC DEVICES FOR MEASUREMENT AND CONTROL OF PRESSURE OF LIQUIDS OR GASES, SPARE PARTS FOR SEMI-AUTOMATIC DISC CUTTING INSTALLATION MODEL ADT 7122. FOR PRODUCTION OF ELECTRONIC COMPONENTS AND CERAMICS | |
|
ISRAEL | RUSSIA | 1 |
| 3919900000 | PLASTIC FILM. SELF-ADHESIVE, IN ROLL, FOR THE PRODUCTION OF SEMICONDUCTOR DEVICES OR ELECTRONIC INTEGRATED CIRCUITS, CIVIL APPLICATION: UV-SENSITIVE FILM; UV-SENSITIVE FILM 300MM DT-510T (28400-0052-300); SIZE 300MM X50M, MANUFACTURE MATERIAL: BASE LAYER: POLYOLEFIN (170 µM), ADHESIVE LAYER: ACRYLIC, UV-CURABLE, PROTECTIVE LAYER: POLYESTER. USED AS A TEMPORARY CARRIER FOR SEMICONDUCTOR WAFERS OR SUBSTRATES THAT NEED TO BE CUTTED INTO DISCRETE COMPONENTS BY THE DISC CUTTING METHOD IN A DISC CUTTING INSTALLATION. THE FILM IS APPLIED ON A METAL OR PLASTIC FRAME WITH A GREATER DIAMETER THAN THE DIAMETER OF THE SEMICONDUCTOR WAFER OR SUBSTRATE, AT THE SAME TIME GLUING THE SEMICONDUCTOR WAFFER OR SUBSTRATE TO THIS FILM. AFTER THE DISC CUTTING OPERATION TO REDUCE THE ADHESION BETWEEN THE FILM AND DISCRETE COMPONENTS, THE FILM IS EXPOSED WITH UV ILLUMINATION, AFTER WHICH THE COMPONENTS ARE REMOVED FROM THE FILM, AND THE FILM ITSELF IS DISPOSED | |
|
JAPAN | RUSSIA | 0 |
| 8538909200 | ELECTRONIC MODULES DO NOT CONTAIN RES AND RF, AND DO NOT HAVE ENCRYPTION AND CRYPTOGRAPHY FUNCTIONS. NOT MILITARY USE, NOT DUAL USE, NOT HAZARDOUS WASTE, NOT HOUSEHOLD USE | |
|
ISRAEL | RUSSIA | 0 |
| 8544429007 | ELECTRICAL CABLES, EQUIPPED WITH CONNECTING DEVICES FOR 24 V VOLTAGE, WITH COPPER CONDUCTORS. NON-FIRE RESISTANT: SPARE PARTS FOR SEMI-AUTOMATIC DISC CUTTING INSTALLATION MODEL ADT 7122, FOR THE PRODUCTION OF ELECTRONIC COMPONENTS AND CERAMICS | |
|
ISRAEL | RUSSIA | 0 |
| 8302490009 | FASTENING ACCESSORIES, SPARE PARTS FOR SEMI-AUTOMATIC DISC CUTTING INSTALLATION MODEL ADT 7122, FOR THE PRODUCTION OF ELECTRONIC COMPONENTS AND CORE | |
|
ISRAEL | RUSSIA | 0 |
| 8486901000 | DEVICES FOR FASTENING TOOLS FOR USE ON EQUIPMENT DESIGNED FOR PRECISION DISC CUTTING OF SEMICONDUCTOR WAFERS AND SUBTRACTS. FOR THE PRODUCTION OF ELECTRONIC COMPONENTS, CIVIL PURPOSE: 2 FLANGES, OVERALL DIMENSIONS: 1.9 | |
|
ISRAEL | RUSSIA | 0 |
| 9026102900 | ELECTRONIC LIQUID LEVEL METERS DO NOT CONTAIN A SOURCE OF IONIZING RADIATION, DO NOT EMERGENCY CONDITION SENSORS, DO NOT CONTAIN RES AND RF. CIVIL PURPOSE, PARTS FOR SEMI-AV | |
|
ISRAEL | RUSSIA | 1 |
| 8486209009 | MACHINES AND EQUIPMENT FOR THE PRODUCTION OF SEMICONDUCTOR DEVICES OR ELECTRONIC INTEGRATED CIRCUITS. CIVIL APPLICATION: ADT 966 SERIES INSTALLATION FOR INSTALLATION OF SEMICONDUCTOR WAVES AND SUBTRACTS ON A FILM CARRIER, THE INSTALLATION IS DESIGNED FOR INSTALLATION OF SEMICONDUCTOR WARES ON A FILM CARRIER UP TO 8 PER CARRIER FRAME, POWER SUPPLY 220 V, 50 G C, 0.75 KW DELIVERY SET IS PARTLY SUPPLIED FOR EASY TRANSPORTATION DISASSEMBLED | |
|
ISRAEL | RUSSIA | 1 |
| 9026202000 | ELECTRONIC DEVICES FOR MEASUREMENT AND CONTROL OF PRESSURE OF LIQUIDS OR GASES, SPARE PARTS FOR SEMI-AUTOMATIC DISC CUTTING INSTALLATION MODEL ADT 7122. FOR PRODUCTION OF ELECTRONIC COMPONENTS AND CERAMICS | |
|
ISRAEL | RUSSIA | 1 |
| 3919900000 | PLASTIC FILM. SELF-ADHESIVE, IN ROLL, FOR THE PRODUCTION OF SEMICONDUCTOR DEVICES OR ELECTRONIC INTEGRATED CIRCUITS, CIVIL APPLICATION: UV-SENSITIVE FILM; UV-SENSITIVE FILM 300MM DT-510T (28400-0052-300); SIZE 300MM X50M, MANUFACTURE MATERIAL: BASE LAYER: POLYOLEFIN (170 µM), ADHESIVE LAYER: ACRYLIC, UV-CURABLE, PROTECTIVE LAYER: POLYESTER. USED AS A TEMPORARY CARRIER FOR SEMICONDUCTOR WAFERS OR SUBSTRATES THAT NEED TO BE CUTTED INTO DISCRETE COMPONENTS BY THE DISC CUTTING METHOD IN A DISC CUTTING INSTALLATION. THE FILM IS APPLIED ON A METAL OR PLASTIC FRAME WITH A GREATER DIAMETER THAN THE DIAMETER OF THE SEMICONDUCTOR WAFER OR SUBSTRATE, AT THE SAME TIME GLUING THE SEMICONDUCTOR WAFFER OR SUBSTRATE TO THIS FILM. AFTER THE DISC CUTTING OPERATION TO REDUCE THE ADHESION BETWEEN THE FILM AND DISCRETE COMPONENTS, THE FILM IS EXPOSED WITH UV ILLUMINATION, AFTER WHICH THE COMPONENTS ARE REMOVED FROM THE FILM, AND THE FILM ITSELF IS DISPOSED | |
|
JAPAN | RUSSIA | 0 |
| 8538909200 | ELECTRONIC MODULES DO NOT CONTAIN RES AND RF, AND DO NOT HAVE ENCRYPTION AND CRYPTOGRAPHY FUNCTIONS. NOT MILITARY USE, NOT DUAL USE, NOT HAZARDOUS WASTE, NOT HOUSEHOLD USE | |
|
ISRAEL | RUSSIA | 0 |
| 8486901000 | DEVICES FOR FASTENING TOOLS, FOR USE ON EQUIPMENT. DESIGNED FOR PRECISION DISC CUTTING OF SEMICONDUCTOR WAFERS AND SUBTRACTS, FOR THE PRODUCTION OF ELECTRONIC COMPONENTS, CIVIL PURPOSE: 2 FLANGES, OVERALL DIMENSIONS: 1.9 | |
|
ISRAEL | RUSSIA | 0 |
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